Semiconductor device



FIG. 1 is a top, front and right side perspective view of a semiconductor device according to my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view being a mirror image thereof;

FIG. 7 is a view of a further embodiment of a semiconductor device similar to FIG. 1, the broken lines illustrating environmental structure of this embodiment which does not form part of the design of this embodiment;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side elevational view thereof, the left side elevational view being a mirror image thereof. 

The ornamental design for a “semiconductor device”, as shown and described. 